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IEEE Rao R. Tummala Electronics Packaging Award

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The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.

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The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium.

Recipients

Recipients of the award for each year include:

References


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